CCTV‑2 Coverage: AI Meets Material Revolution — Tsingyan Electronics Expands from PTFE CCL toward AIDC Energy Ecosystem

Recently, the technological innovations of Tsingyan Electronics have been featured on CCTV‑2, China Central Television’s Finance Channel. Built on its proprietary PIFs dry‑process technology system, Tsingyan is building a technical portfolio spanning high‑end electronic materials and intelligent energy applications. Its premium PTFE‑based copper‑clad laminates target high‑speed interconnection requirements for AI servers, while dry‑process supercapacitors focus on energy‑assurance scenarios for AI data centers. From fundamental materials to end‑use applications, Tsingyan is exploring technical pathways for next‑generation computing infrastructure.

01 Rising AI Computing Power Drives Demand for High‑End Electronic Materials

Within AI servers and high‑speed communication hardware, PCBs realize data interconnections between chips and modules. As the core raw material for PCB manufacturing, copper‑clad laminates directly determine signal‑transmission efficiency and system reliability.

As AI servers evolve toward higher computing power and faster interconnection speeds, conventional CCL materials face new challenges in low‑loss performance, high‑frequency characteristics and processing stability.

Featuring low dielectric loss and superior high‑frequency‑high‑speed performance, PTFE‑based CCL has emerged as a critical material option for premium communications, servers and AI infrastructure.

02 PIFs Technology Boosts Performance of High‑End PTFE CCL

Responding to technical demands within high‑end electronic materials, Tsingyan Electronics develops PTFE‑based CCL by optimizing material architectures and dry‑process workflows to enhance overall product performance.

Material stiffness constitutes one of the key metrics for high‑grade PCB fabrication.

During PCB manufacturing, drilling accuracy directly governs circuit‑connection reliability. As AI servers and high‑speed switching equipment impose stricter requirements on PCB layer counts, circuit density and machining precision, the stability of CCL substrates grows increasingly vital.

Tsingyan’s high‑end PTFE CCL delivers favorable mechanical stiffness, which improves stability during drilling operations and reduces machining deviations, providing material support for high‑precision PCB production.

Meanwhile, the product satisfies performance requirements for low dielectric loss and high‑speed signal transmission, meeting material specifications for AI servers and high‑speed communications hardware.

03 From CCL to AI Servers: Deploying Foundational Materials for Computing Infrastructure

Growth across the AI industrial chain relies on coordination among chips, servers, data centers and upstream fundamental materials.

Although high‑performance CCL sits in the upper reaches of the supply chain, it exerts a direct influence on data‑transfer efficiency and operational reliability of AI hardware systems.

Tsingyan Electronics is advancing industrial‑scale production of high‑end CCL: ‑ Annual capacity for high‑end CCL will reach 300 000 m² by the end of 2026. ‑ An additional 1 000 000 m² of annual capacity is planned by the end of 2027.

With capacity expansion underway, Tsingyan will strengthen its large‑volume supply capacity for premium PTFE CCL, serving market demands for high‑speed communications, AI servers and AIDCs.

04 Dry‑Process Supercapacitors for AIDC Energy‑Assurance Scenarios

With the rapid expansion of AIDCs, energy assurance has become a key challenge for computing infrastructure. AIDC development calls not only for elevated computing capacity but also more efficient and dependable energy‑management solutions. Peak‑power handling, rapid power response and power‑quality optimization will represent major development trends for data‑center energy systems.

Tsingyan’s dry‑process supercapacitors feature high power density, fast charge‑discharge capability and long cycle life, conferring technical advantages for use‑cases requiring rapid energy response.

In future AIDC energy systems, dry‑process supercapacitors can function as auxiliary energy‑regulation units to handle peak‑power management and transient‑load response, enhancing overall energy‑system stability.

Tsingyan has established a dual‑track technical layout for AI‑oriented infrastructure: ‑ High‑end PTFE CCL addresses high‑speed data‑transmission needs of AI servers; ‑ Dry‑process supercapacitors cater to energy‑security requirements for AIDC facilities.

Both technology lines align with infrastructure upgrading in the AI era.

05 Centered on Dry‑Process Technology, Expanding Application Boundaries of AI Infrastructure

Centered on proprietary PIFs dry‑process technology, Tsingyan Electronics targets key segments of AI‑era infrastructure. High‑end PTFE CCL supplies high‑performance interconnection substrates for AI servers and high‑speed communications, while dry‑process supercapacitors deliver efficient and stable energy support for large‑scale intelligent computing.

Tsingyan will keep innovating dry‑process technologies, promote the integrated development of high‑end electronic materials and advanced energy‑storage solutions, build core technical capabilities for the AI industrial chain, and provide underlying material support for China’s computing‑infrastructure construction.