EAC 2026 Highlights | Tsingyan Electronics Empowers Millimeter‑Wave Radar Industrial Upgrade

On May 28‑29, EAC 2026 Autonomous Driving and Robotics Industry Exhibition opened grandly at Shanghai Automobile Exhibition Center. The concurrent 8th Advanced Automotive Millimeter‑Wave Radar Technology Exhibition & Exchange Conference concluded successfully. Centering on cutting‑edge technologies and industrial innovation trends for automotive millimeter‑wave radars, the event welcomed Tsingyan Electronics at Booth S635 with its self‑developed core high‑end copper‑clad laminate (CCL) technologies. Leveraging two robust proprietary innovations — patented mixing technology and powder‑to‑film technology, Tsingyan demonstrated its solid technical capabilities. As the exclusive sponsor for the official conference dinner, Tsingyan further engaged in the industry ecosystem and joined partners from all sectors for technical exchanges.

Process‑Driven Excellence for Improved Material Performance

At the exhibition, Tsingyan Electronics highlighted process innovation and performance upgrades by showcasing two flagship products: TY‑HF3003 High‑Frequency CCL and TY‑HS1100 High‑Speed CCL. Built upon ceramic powder surface modification and customized resin formulation technologies, the products deliver core competitive strengths including cost‑efficiency, high precision and full‑process traceability, perfectly suited for high‑end automotive applications such as automotive millimeter‑wave radars and high‑speed signal transmission.

TY‑HF3003 high‑frequency copper‑clad laminate features stable dielectric properties and extremely low loss under high‑frequency operating conditions. It also offers outstanding thermal stability and reliable copper‑foil peel strength. With mature manufacturing processes, it guarantees high‑quality, consistent mass‑production for end‑devices and lays a solid material foundation for long‑term stable operation of automotive high‑frequency equipment.

Optimized for high‑speed transmission scenarios, TY‑HS1100 high‑speed CCL exhibits ultra‑low loss and minimal water absorption. It boasts excellent dimensional stability and copper‑foil bonding strength, effectively mitigating signal distortion and attenuation during high‑speed transmission, and meeting the high‑precision, high‑sensitivity signal‑transmission requirements of autonomous driving.

Collaborative Exchanges to Fuel Industrial Innovation

Technology thrives through collaboration and knowledge sharing. Luo Xufang, R&D Director of Tsingyan Electronics, delivered an on‑site presentation covering new‑generation high‑end CCL technologies, industry trends and end‑use applications. His speech focused on high‑frequency material innovation: How Dry‑Process PTFE Substrates Break Performance Bottlenecks for Millimeter‑Wave Radars.

Tsingyan’s in‑house dry‑process powder‑to‑film PTFE technology addresses pain points inherent to conventional wet‑process PTFE. The TY‑HF3003 and TY‑HS1100 series PTFE‑based high‑frequency & high‑speed CCLs achieve superior metrics including lower insertion loss, stable Dk/Df (TCDk), and CTE well‑matched with copper foils. Additional advantages include solvent‑free eco‑friendly production, uniform filler dispersion, excellent thickness and batch‑to‑batch consistency, and compatibility with laser blind‑hole and multi‑layer hybrid lamination processes. Already in scaled mass production, they serve as a core material solution for millimeter‑wave radar upgrades.

From accurate prototyping to consistent quality across tens‑of‑thousands of mass‑produced units, Tsingyan Electronics has built an integrated full‑chain R&D and manufacturing system for high‑end CCL products. Moving forward, Tsingyan will keep advancing technical innovation, explore uncharted process‑technology domains, and continuously break down high‑end material barriers. With superior product quality and innovative strength, Tsingyan will drive high‑quality and domestic‑based innovation for high‑end CCLs used in automotive millimeter‑wave radars.